Application:Used for grinding silicon wafer,semiconductor compound wafer,etc.

Feature:
1、Finally thickness difference:transverse<5um,longitudinal<8um.
2、We can supply two types of grinding wheel:Whole grinding and Half grinding.

Get rod from the sapphire, polysilicon and other hard and brittle materials.

Long service life,moderate dressing interval,good shape
retention of grinding wheel,and high comprehensive price
ratio.

With high speed, high efficiency and high precision grinding
of automobile, bearing, air conditioning, machine tools and
other parts, our products have reached the level of Germa-
ny,Japan and other countries.

Good shape maintenance,high material removal rate.Good abrasion resistance and long work time.