Grinding wheel for monocrystalline silicon
Application:Used for grinding silicon wafer,semiconductor compound wafer,etc.
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Sapphire Grinding wheel
Feature:
1、Finally thickness difference:transverse<5um,longitudinal<8um.
2、We can supply two types of grinding wheel:Whole grinding and Half grinding.
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1、Finally thickness difference:transverse<5um,longitudinal<8um.
2、We can supply two types of grinding wheel:Whole grinding and Half grinding.
Diamond Core Drill
Get rod from the sapphire, polysilicon and other hard and brittle materials.
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Metal-bond cemented carbide grinding wheel
Long service life,moderate dressing interval,good shape
retention of grinding wheel,and high comprehensive price
ratio.
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retention of grinding wheel,and high comprehensive price
ratio.