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Products
LWCDS-PDA

LWCDS-PDA

PDA PRO TM laser welded blades for the professional cutting in road and floor construction.
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Grinding wheel for monocrystalline silicon

Grinding wheel for monocrystalline silicon

Application:Used for grinding silicon wafer,semiconductor compound wafer,etc.
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Sapphire Grinding wheel

Sapphire Grinding wheel

Feature:
1、Finally thickness difference:transverse<5um,longitudinal<8um.
2、We can supply two types of grinding wheel:Whole grinding and Half grinding.
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Diamond Core Drill

Diamond Core Drill

Get rod from the sapphire, polysilicon and other hard and brittle materials.
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Metal-bond cemented carbide grinding wheel

Metal-bond cemented carbide grinding wheel

Long service life,moderate dressing interval,good shape
retention of grinding wheel,and high comprehensive price
ratio.
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